Revised Standards for IPC-H, IPC-J-STD-001, and IPC-A-610 in Soldering Practices
The electronics industry has seen significant changes with the release of the H revisions of the IPC-J-STD-001 and IPC-A-610 soldering standards in September 2020. These revisions primarily focus on enhancing the quality and reliability of electronic assemblies in manufacturing.
IPC-J-STD-001H, a process standard, specifies requirements for soldered electrical and electronic assemblies. Its primary focus is on process control and materials to ensure reliable joints, detailing how to achieve acceptable solder joints. On the other hand, IPC-A-610H, a product standard, defines acceptance criteria for the visual quality of electronic assemblies after production.
| Aspect | IPC-J-STD-001H | IPC-A-610H | |-----------------------------|------------------------------------------------|-------------------------------------------------| | **Purpose** | Specifies *requirements for soldered electrical and electronic assemblies* | Defines *acceptance criteria for the visual quality* of electronic assemblies | | **Scope** | Provides detailed *materials, methods, and process controls* for soldering | Provides *visual acceptance criteria* for solder joint quality and overall assembly appearance | | **Focus on Quality Classes** | Addresses quality classes with respect to process capabilities and joint reliability requirements | Refines criteria for Class 1, 2, and 3 assemblies, emphasizing end-product acceptance levels and visual standards | | **Document Use in Production** | Used for establishing *process controls, procedures, training,* and inspection criteria for soldering during manufacturing | Used primarily by quality inspectors for *final product inspection* | | **Certification Training** | Certification focuses on soldering process control and workmanship per established process requirements | Certification centers around inspecting and judging assembly quality according to visual standards |
Some key updates in the H revisions include the introduction of two new sections in IPC-J-STD-001: 4.17 for threaded fastener criteria and 4.18 for torque requirements. Appendix D, a compilation of applicable through-hole X-ray criteria, does not specify any soldering requirements in the updated paragraph 8. Maximum toe overhang is now based on lead length in the updated paragraph 7, and the standards for soldering requirements of the thermal plane in 7.5.15 are updated in the same paragraph.
In 5.4.1.4, a statement of wiring overlap is added, with conditions for class 1, class 2, and class 3 boards. 5.4.1.5 is renamed as insulation sleeving, defining the insulation clearance standards. Class 2 and 3 manufacturing processes must include a documented method that reduces the risk of cross-contamination between Pb and Pb-free products, as stated in 3.2.1 of the new soldering standards.
The new criteria in IPC-A-610 and J-STD-001 do not include equipment requirements, and a certified person is not necessary to conduct a non-destructive examination according to the new standards. The customer has to specify the minimum toe fillet height for bottom termination components in the updated paragraph 7, and a new section 7.5.19 is added for vertical cylindrical cans with outwards L-shaped lead terminations in the same paragraph.
The term "circumferential solder separation" is added in section 1.8.1 of IPC-J-STD-001, and the minimum heat fillet height is no longer based on the lead thickness in the updated paragraph 7. The specifications for an efficient soldering process, including cleaning procedure and documentation, are listed in 8.1 in the updated paragraph 8. End overhang is allowed when all other criteria have been met in the updated paragraph 7.
Other changes in the document include the removal of sections 4.4 and 4.5, updates to cooling lines and secondary reflow, addition of heat-shrinkable soldering devices, a new soldering anomaly (solder inclusions), clarification on adhesive bonding for components such as box capacitors, modifications in section 8.3.5, the criteria for maximum toe overhang now based on the length of the lead foot, the thermal plane can have up to 50% voiding if there are no specifications by the customer, addition in 8.3.19 on wrapped terminals, definitions for encapsulated and entrapped, update of section 10.8.3 with a table that includes the coating thickness, and the criteria for the solderless wrap are removed in the updated IPC-A-610.
The H revisions of soldering standards aim to ensure process integrity and final product quality in electronics manufacturing. With these updates, manufacturers can produce more reliable and visually acceptable electronic assemblies, contributing to the overall improvement of the electronics industry.
[1] IPC-J-STD-001H (2020). IPC-A-610H (2020). [2] IPC-J-STD-001H, Section 11.3.1.1, IPC-A-610H, Section 11.3.1.1.
The H revisions of IPC-J-STD-001 and IPC-A-610 soldering standards, released in September 2020, emphasize technology advancements in electronics manufacturing by focusing on enhancing the quality and reliability of electronic assemblies. For instance, the new IPC-J-STD-001H includes sections for threaded fastener criteria and torque requirements, promoting improved manufacturing processes. Moreover, the updated IPC-A-610H refines criteria for Class 1, 2, and 3 assemblies, highlighting visual standards for end-product inspection. This technology-driven evolution aims to ensure process integrity and final product quality, contributing to the improvement of the electronics industry.
