Intel & AWS Team Up for Multi-Billion Dollar Chip Co-Design
Intel and Amazon Web Services (AWS) have joined forces in a multi-year, multi-billion-dollar co-investment to develop custom chip designs. This collaboration aims to support the growth of both businesses and foster a sustainable domestic AI supply chain.
The partnership will see Intel produce a custom Xeon 6 chip on Intel 3 for AWS. Additionally, Intel will manufacture an AI fabric chip for AWS on the Intel 18A process node, with early silicon versions expected in 2026/27 and full deployment by 2028.
AWS has committed to investing US$7.8 billion to expand its data centre operations in Central Ohio. This expansion will be supported by Intel's commitment to building leading-edge semiconductor manufacturing in the New Albany area. The two companies plan to explore further designs based on Intel 18A, 18AP, and 14A process nodes, including production in Intel's Ohio facilities.
Intel's CEO, Pat Gelsinger, stated that the expansion reflects Intel's strong process technology and delivers differentiated solutions for customer workloads. AWS's CEO, Matt Garman, mentioned that the collaboration allows them to empower customers with the ability to run any workload and unlock new AI capabilities. The partnership aims to power virtually any workload and accelerate AI application performance.
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